PCB circuit board processing and special process-PCB-electronics industry - Automobile Tracking Devices Manufacturer

Circuit board PCB Machining process as a special field in the PCB industry, the people, for the PCB copy board, PCB design related process must be skilled, professional PCB copy through our panel of people in the conclusion, we have a professional PCB copy board of experts come to the following lines board PCB processing special process in the hope of the PCB industry to help.

AdditiveProcess Addition Refers to non-conductive substrate surface, the additional resist the assistance of the local chemical copper layer conductor lines, the growth process directly (see Board Information Journal, No. 47, P.62). PCB copy board plus method used can be divided into full addition, half of Addition and part of the addition of other different ways.

Backpanels, Backplanes support plate Is thicker (eg, 0.093 ", 0.125") of the circuit board, specifically for the plug to contact the other board. The approach is to first insert a multi-pin Connector (Connector) a tight hole, but do not solder, but across the board in the connector pins on each lead, then one by one cable winding means. Connector on the PCB can be copied into the general board. Because of this particular board, the hole can not solder, but the cell wall and lead to direct clamping needle to use, so the quality and aperture requirements are particularly stringent, their orders are not a lot of general circuit board are unwilling to not easy to take such orders, in the United States has almost become a high-grade and specialized business. Additional layer of legal process

BuildUpProcess This is a new area of thin multilayer approach, the first is from IBM's SLC enlightenment process, by its Japan Yasu plant started trial production in 1989, the law is for the traditional two-panel basis, since the two first-round outer surface coating of liquid photosensitive precursors such as Probmer52, by the semi-hardened and sensitive Jie Xiang, make a shallow connected with the next low-level form "Photographic pilot hole" (Photo-Via), further chemical plating of copper with an overall increase in copper conductor layer, but also by line imaging and etching, get new wires and interconnect with the underlying buried holes or blind holes. Repeat this additional layer will receive the required number of layers of multilayer boards. This method not only can avoid costly mechanical drilling costs, and its pore size can be reduced to 10mil even less. Over the past 5 to 6 years, all by breaking the tradition changed to successive layers of multilayer technology industry in the United States and Japan continue to push under, making these BuildUpProcess fame, has more than ten kinds of products the market Zheyi more. In addition to the above-mentioned "Photographic hole" outside; there after the removal of copper holes for basic organic chemicals bite plate hole, laser hole burning (LaserAblation), and plasma etching holes (PlasmaEtching) so different "as hole "approach. But also can also be made of semi-hardened resin coating of the new "gum foil" (ResinCoatedCopperFoil), using successive lamination method (SequentialLamination) made in a more intensive small and thin multilayer. A variety of personal future Electronic Products, will be the light of this real world short multilayer.

Cermet Cermet, ceramic powder and metal powder mixture, then add as a kind of bonding agent Paint Can the circuit board (or the inner upper) to thick or thin film of printing, as a "resistor" of the cloth was placed to replace the assembly of the external resistor.

Co-Firing of fire

A ceramic hybrid circuit board PCB (Hybrid) of a process, the surface of the small plates have been printed all kinds of precious metal thick film paste (ThickFilmPaste) line, placed in the firing temperature. To make thick paste in a variety of organic carriers were burned, leaving precious metals conductor lines to as the interconnect wire.

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